Diamond Wire Cutting Wafer

20 μm 20 μm results subject to change based on process material and cutting orientation parameters cropless ingot process diamond wire.

Diamond wire cutting wafer.

Our lead times are short and we can accommodate requirements from r d to production quantities. It is important that the adhesive does not contaminate the debonding bath and the silicon but adheres to the carrier. 32 n 35 n cut time 180 minutes 150 minutes tv5. 12 m sec 12 m sec wire tension.

Contract diamond wire slicing. Along with a wide range of meyer burger wafer slicing systems we now feature the world renowned state of the art meyer burger dw 288 diamond wire slicing systems for hard and brittle materials. 310 μm feed rate. 15 μm 15 μm warp.

In addition to the supply of diamond wire we can also provide high quality diamond beads with customized sizes or in the following average diameters. Abrasive slurry saw wire with abrasive slurry diamond wire without abrasive slurry silicon. We offer contract slicing using diamond wire. Diamond wire saw is an environmentalhigh efficient safe cutting tool which is a specially designed for cutting and separating crystal material magnetic material or sapphire wafer.

Along with a wide range of meyer burger slicing systems we now feature the world renowned state of the art meyer burger dw 288 and meyer burger dw 265 diamond wire slicing systems for hard and brittle. 15 μm 15 μm bow. Afterwards the wafers can be separated from the carrier plate without any residues. Wire saw contract cutting and wafer slicing slicingtech serves the needs of companies who require high precision high volume wafer slicing.

The diamond wire slicing process we employ provides our customers less kerf loss with outstanding finishes to micron level tolerances. The new environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws. You can request information concerning quantity details and prices by contacting us or filling in the form. Wafer production places high demands on the technology used while the market demands maximum efficiency from manufacturers.

Logitech s model 15 diamond wire disc saw is a compact saw ideal for the precision slicing and dicing of materials from the most delicate crystals to the hardest ceramics. The diamond wire cutting head is used whenever there is a requirement to produce a cut with minimum surface and sub surface damage. 200 μm 250 μm wire speed. Siemens offers optimized automation concepts for high performance ingot cutting machines.